Rolled Copper Foil
Overview
Rolled copper foil is more flexible than electrolytic copper foil, and has stable mechanical properties under high temperature conditions. It is an optimal material for high density mounting of electronic devices. Using our excellent metal rolling technology, we provide rolled copper foils that can meet our customers' requirements for fine patterning, which is important for high density mounting circuits, and high quality rolled copper foils that are 1) thin in thickness (0.007 mmt), are 2) high-precision, and 3) have good flatness.

Quality characteristics
1.Materials
- Oxygen-free copper : C1020R
- Tough pitch copper : C1100R
- Copper alloy
2.Thickness
Minimum thickness 0.007 mmt, 0.010 mmt, 0.016 mmt, 0.033 mmt, etc. Various thicknesses are available.
Applications
- Copper foil for FPC circuit formulation
- Battery materials
- Shielding
Packaging
Coiled, in wooden case packing
Contact
Mitsui Sumitomo Metal Mining Brass & Copper Co., Ltd. Sales Dept.
Yoshiyasu Kanda Building the 8th floor, 2-1-15, Iwamoto-cho, Chiyoda-ku, Tokyo 101-0032, Japan
Phone: 81-3-6367-5678
Facsimile: 81-3-3864-7789
Sales Dept. Nagoya Branch
Sakae SunCity Building the 16th floor, 4-1-8, Sakae, Naka-ku, Nagoya-City, Aichi 460-0008, Japan
Phone: 81-52-259-2600
Facsimile: 81-52-259-2601